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ZALM-300 Series
PROCESSING (Continued)
Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
Wave Soldering
If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave
soldering process is encouraged.
Hand Soldering
Hand soldering is possible. Use a soldering iron temperature setting equivalent to 350°C, follow IPC recommendations/
reference document IPC-7711.
Rework
The Apex LT Module can be unsoldered from the host board. Use of a hot air re-work tool and hot plate for pre-heating from
underneath is recommended. Avoid overheating.
!Warning Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will terminate
warranty coverage.
Additional Grounding
Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover
is done at the customers own risk. The numerous ground pins at the module perimeter should be sufficient for optimum
immunity to external RF interference.
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